AIA/NAS NAS4123

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP) - Rev 1

contributor author	AIA/NAS - Aerospace Industries Association of America Inc.
date accessioned	2017-09-04T16:32:28Z
date available	2017-09-04T16:32:28Z
date copyright	03/30/2012
date issued	2012
identifier other	URNTUEAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quein/handle/yse/95904
language	English
title	AIA/NAS NAS4123	num
title	HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP) - Rev 1	en
type	standard
page	16
status	Active
tree	AIA/NAS - Aerospace Industries Association of America Inc.:;2012
contenttype	fulltext