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JEDEC JEP170

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

Organization:
JEDEC - Solid State Technology Association
Year: 2013

Abstract: This publ impact en considere products. or visual n in actual p lication prov nd-user produ d visual nonc Finally, it w nonconformit product drawi ides descript cts and/or app conformities s ill depict a m ties and guida ings and spec tion of defec plications. It since they sho method for visu ance for dispo cifications. ts observed will also prov ould be less d ual inspection osition. Offic in FCxGA c vide illustrati disruptive of q n that can be u cial criteria fo components t ion on other d quality or reli utilized to ide or product acc that can adve defects that m ability to cus entify these d ceptance shou ersely may be tomer defects uld be
URI: http://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/68937
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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T16:05:44Z
date available2017-09-04T16:05:44Z
date copyright01/01/2013
date issued2013
identifier otherRWRQBFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;quein=autho123393FD081DAC4/handle/yse/68937
description abstractThis publ impact en considere products. or visual n in actual p lication prov nd-user produ d visual nonc Finally, it w nonconformit product drawi ides descript cts and/or app conformities s ill depict a m ties and guida ings and spec tion of defec plications. It since they sho method for visu ance for dispo cifications. ts observed will also prov ould be less d ual inspection osition. Offic in FCxGA c vide illustrati disruptive of q n that can be u cial criteria fo components t ion on other d quality or reli utilized to ide or product acc that can adve defects that m ability to cus entify these d ceptance shou ersely may be tomer defects uld be
languageEnglish
titleJEDEC JEP170num
titleGuidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)en
typestandard
page18
statusActive
treeJEDEC - Solid State Technology Association:;2013
contenttypefulltext
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