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JEDEC JESD11
Chip Carrier Pinouts Standardized for CMOS 4000, HC and HCT Series of Logic Circuits
Organization:
JEDEC - Solid State Technology Association
Year: 1984
Abstract: This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages.
Subject: Chip Carrier Pinouts
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:03:07Z | |
| date available | 2017-09-04T16:03:07Z | |
| date copyright | 01/01/1984 | |
| date issued | 1984 | |
| identifier other | RPMQCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=3826AF679D40527318548F1Egin/handle/yse/66327 | |
| description abstract | This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages. | |
| language | English | |
| title | JEDEC JESD11 | num |
| title | Chip Carrier Pinouts Standardized for CMOS 4000, HC and HCT Series of Logic Circuits | en |
| type | standard | |
| page | 10 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;1984 | |
| contenttype | fulltext | |
| subject keywords | Chip Carrier Pinouts | |
| subject keywords | CMOS Devices - 4000 | |
| subject keywords | Logic Circuits - HC and HCT |