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ECA 216
Adhesion of Printed Wiring, Method of Test fo
| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:07:57Z | |
| date available | 2017-09-04T16:07:57Z | |
| date copyright | 01/01/1959 (R 1983) | |
| date issued | 1983 | |
| identifier other | SCSGCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=anid=47037D83081DAC4218546D6E273C9FCD/handle/yse/71153 | |
| description abstract | This Standard is intended for determining the following characteristics of printed wiring boards: (a) resistance to pull-off of lands before and after soldering of component leads, (b) resistance to peel or stripping of conductors at standard room temperature before and after solder dipping, and at elevated temperatures, and (c) resistance of large conductor areas to blistering as a result of solder dipping. | |
| language | English | |
| title | ECA 216 | num |
| title | Adhesion of Printed Wiring, Method of Test fo | en |
| type | standard | |
| page | 9 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1983 | |
| contenttype | fulltext |
