ECA EIA/ECA-955
SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION)
contributor author | ECIA - Electronic Components Industry Association | |
date accessioned | 2017-09-04T18:07:50Z | |
date available | 2017-09-04T18:07:50Z | |
date copyright | 39356 | |
date issued | 2007 | |
identifier other | GQCCBCAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;query=autho1626AF679D40527318549F1EFDEC014A/handle/yse/190798 | |
description abstract | Description This document details the qualification requirements for surface mount aluminum chip capacitors with polymer cathode. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of their responsibility to their own company's internal qualification program. Preconditioning This process is intended to simulate exposure to the moisture, thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of processes are described in IPC-9504. It is required that a flux with a pH of less than 2 be used for this preconditioning requirement. | |
language | English | |
title | ECA EIA/ECA-955 | num |
title | SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION) | en |
type | standard | |
page | 15 | |
status | Active | |
tree | ECIA - Electronic Components Industry Association:;2007 | |
contenttype | fulltext |