IPC SMC-WP-005

PWB Surface Finishes

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:27:07Z
date available	2017-09-04T18:27:07Z
date copyright	04/01/1997
date issued	1997
identifier other	INHXNAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho162s7D83081DAC4/handle/yse/209348
description abstract	INTRODUCTION The acceptance and use of Organic Solderability Preservatives (aSPs) as replacements for Hot Air Solder Leveling (HASL) continues to grow. aSPs selectively protect and maintain the solderability of a PCB's copper features (i.e. SMT pads, through-holes) by providing thermal protection against degradation during assembly. Historically one class of aSP, the benzotriazole inhibitors, has been successfully used by a number of major OEMs in select assembly applications requiring a single heat excursion. During the past five years a new upgraded class of aSP, the substituted benzimidazole, has proven to yield additional benefits to PCB fabricators while addressing a diversity of processing challenges encountered by PCB assemblers and OEMs.
language	English
title	IPC SMC-WP-005	num
title	PWB Surface Finishes	en
type	standard
page	51
status	Active
tree	IPC - Association Connecting Electronics Industries:;1997
contenttype	fulltext
subject keywords	PWB soldering
subject keywords	surface finish
subject keywords	wire bonding