IPC CH-65B
Guidelines for Cleaning of Printed Boards and Assemblies
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:38:04Z | |
| date available | 2017-09-04T16:38:04Z | |
| date copyright | 07/01/2011 | |
| date issued | 2011 | |
| identifier other | VHIUMEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162s7D83FCDCAC4261598F1EFDEC014A/handle/yse/101641 | |
| description abstract | This manual will only include assembly process printed wiring assembly cleaning. The corresponding information on printed wiring board cleaning will be contained in a separate companion document. Purpose The purpose of this document is to collect and update all the pertinent information on printed wiring assembly (PWA) cleaning in a single, easy to revise/updated document. | |
| language | English | |
| title | IPC CH-65B | num |
| title | Guidelines for Cleaning of Printed Boards and Assemblies | en |
| type | standard | |
| page | 216 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |

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