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Guidelines for Cleaning of Printed Boards and Assemblies

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:38:04Z
date available2017-09-04T16:38:04Z
date copyright07/01/2011
date issued2011
identifier otherVHIUMEAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho162s7D83FCDCAC4261598F1EFDEC014A/handle/yse/101641
description abstractThis manual will only include assembly process printed wiring assembly cleaning. The corresponding information on printed wiring board cleaning will be contained in a separate companion document.
Purpose The purpose of this document is to collect and update all the pertinent information on printed wiring assembly (PWA) cleaning in a single, easy to revise/updated document.
languageEnglish
titleIPC CH-65Bnum
titleGuidelines for Cleaning of Printed Boards and Assembliesen
typestandard
page216
statusActive
treeIPC - Association Connecting Electronics Industries:;2011
contenttypefulltext


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