IPC CF-152B

Composite Metallic Material Specification for Printed Wiring Board

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:41:34Z
date available	2017-09-04T16:41:34Z
date copyright	35765
date issued	1997
identifier other	VPNEDAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho162s7D83FCDCAC4261598F1EFDEC014A/handle/yse/104887
description abstract	This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum. Purpose This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.
language	English
title	IPC CF-152B	num
title	Composite Metallic Material Specification for Printed Wiring Board	en
type	standard
page	33
status	Active
tree	IPC - Association Connecting Electronics Industries:;1997
contenttype	fulltext