درباره ما
IPC TM-650 2.3.15D
Purity, Copper Foil or Plating
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This is an electrogravimetric method for determining the purity of copper foil or plating.
Collections
:
-
Statistics
IPC TM-650 2.3.15D
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:25:22Z | |
| date available | 2017-09-04T16:25:22Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | TXOHFBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162s7D83FCDCAC4261598F1EFDEC014A/handle/yse/88611 | |
| description abstract | This is an electrogravimetric method for determining the purity of copper foil or plating. | |
| language | English | |
| title | IPC TM-650 2.3.15D | num |
| title | Purity, Copper Foil or Plating | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |