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IPC TM-650 2.6.3.6
Surface Insulation Resistance - Fluxes - Telecommunications
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:30:19Z | |
| date available | 2017-09-04T16:30:19Z | |
| date copyright | 01/01/2004 | |
| date issued | 2004 | |
| identifier other | ULLGIBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162s7D83FCDCAC4261598F1EFDEC014A/handle/yse/93620 | |
| description abstract | This test method is used to characterize the effects of flux residues on electrical performance by determining the degradation of electrical insulation resistance under conditions of high temperature and humidity. This method, in conjunction with the supporting documentation in IPC-J-STD-004, is intended to be equivalent to Telcordia Technologies GR-78-CORE, Section 13.1, (Corrosiveness of Soldering Fluxes) and is used primarily by telecommunications companies to qualify the candidate flux or solder paste. | |
| language | English | |
| title | IPC TM-650 2.6.3.6 | num |
| title | Surface Insulation Resistance - Fluxes - Telecommunications | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |
