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IPC TM-650 2.4.40
Inner Layer Bond Strength of Multilayer Printed Circuit Boards
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:34:28Z | |
| date available | 2017-09-04T16:34:28Z | |
| date copyright | 32051 | |
| date issued | 1987 | |
| identifier other | UXJNCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162s7D83FCDCAC4261598F1EFDEC014A/handle/yse/97972 | |
| description abstract | This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric. | |
| language | English | |
| title | IPC TM-650 2.4.40 | num |
| title | Inner Layer Bond Strength of Multilayer Printed Circuit Boards | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |
