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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 41-60 of 793
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IPC J-STD-005 JAPANESE
Abstract: This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended ... -
IPC D-330
Abstract: The purpose of the IPC Design Guide is to make information available to users and designers of rigid and flexible printed boards as well as hybrid and multichip modules. This documents contains a compilation of valuable ... -
IPC TM-650 2.5.17E
Abstract: This test method is designed to determine both the volume (cross-sectional) and surface electrical resistance of the dielectric material under humid conditions. -
IPC QL-653A
Abstract: This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluating ...Subject(s) : Certification , Components , Inspection Facilities , Materials , Printed Wiring Boards , Test Facilities , Test Laboratories , -
IPC IPC/EIA J-STD-028
Abstract: This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards ... -
IPC 2546
Abstract: IPC-2546 describes the event message content specific to assembly equipment. This standard shall be used together with the IPC-2541 standard entitled "Generic Requirements for Electronics Manufacturing Shop Floor Equipment ... -
IPC SMC-WP-001
Abstract: INTRODUCTION
What does good solderability mean?
Solderability has been defined to varying levels of detail depending on the observer's immediate perspective. The fundamental ... -
IPC TR-464
Abstract: ABSTRACT
There is a growing need for a method of evaluating the solderability retention capability of printed circuit parts during inventory storage. These circuit parts, including components, connectors, ... -
IPC TM-650 2.3.9D
Abstract: This test method is designed to determine the degree of flame resistance of laminates less than 0.5 mm [0.020 in] in thickness, and prepreg. -
IPC 1752A
Abstract: This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for electrical and electronic product. This standard applies to products, components, subproducts ... -
IPC TR-460A
Abstract: FOREWORD
The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group.
The objective of this ... -
IPC 4101D
Abstract: This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. -
IPC A-610E
Abstract: This standard is a collection of visual quality acceptability requirements for electronic assemblies.
This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, ... -
IPC TM-650 2.3.7A
Abstract: To determine the quality of the dielectric material after etching with ferric chloride. -
IPC 2578
Abstract: This standard (IPC 2578) covers the sectional requirements for the exchange of Bills of Material (BOM), Approved Manufacturer Lists (AML), Approved Supplier Lists (ASL), as well as the description of the components involved ... -
IPC MC-790
Abstract: Foreword
The developments over the past 8–10 years reflected in this document have resulted in a variety of new materials, structures, and interconnect methodologies. This ‘‘smorgasbord'' ... -
IPC TM-650 2.5.6.1B
Abstract: The dielectric strength test (also called highpotential [Hi-Pot], over potential, or voltage breakdown) consists of the application of a test voltage for a specific time between mutually insulated portions of a printed ... -
IPC 1071
Abstract: Purpose The purpose of this standard is to assist printed board (PB) manufacturers in the development of requirements for the protection of intellectual property (IP) for their customers in commercial, ...