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SMD-5962-91762 REV B
MICROCIRCUIT, DIGITAL, CMOS, 4 X 8 BIT MULTILEVEL PIPELINE REGISTER, MONOLITHIC SILICON
| contributor author | DLA - CC - DLA Land and Maritime | |
| date accessioned | 2017-09-04T18:45:19Z | |
| date available | 2017-09-04T18:45:19Z | |
| date copyright | 01/15/1993 | |
| date issued | 1993 | |
| identifier other | KHAXDAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162sear3FCDCAC4261598F1EFDEC014A/handle/yse/226776 | |
| description abstract | This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. The PIN shall be as shown in the following example: Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function Propagation Delay 01 L29C520 4 × 8-bit multilevel pipeline register 30 ns 02 L29C520 4 × 8-bit multilevel pipeline register 24 ns 03 L29C520 4 × 8-bit multilevel pipeline register 16 ns 04 L29C521 4 × 8-bit multilevel pipeline register 30 ns 05 L29C521 4 × 8-bit multilevel pipeline register 24 ns 06 L29C521 4 × 8-bit multilevel pipeline register 16 ns The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535 For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below. Outline letter Case outline L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100" maximum), square leadless chip carrier package K F-6 (24-lead, .640" × .420" × .090"), flat pack The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Operating ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C VCC supply voltage with respect to ground . . . . . . . . . . . . . . . . . . −0.5 V to +7.0 V Input signal with respect to ground . . . . . . . . . . . . . . . . . . . . . −3.0 V to +7.0 V Signal applied to high impedance output . . . . . . . . . . . . . . . . . . . −3.0 V to +7.0 V Output current into low outputs . . . . . . . . . . . . . . . . . . . . . . . 25 mA Latchup current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 200 mA Thermal resistance, junction-to-case (ΘJC). . . . . . . . . . . . . . . . . . See MIL-M-38510, appendix C Power dissipation (PD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mW Junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C Lead temperature (soldering, 10 seconds). . . . . . . . . . . . . . . . . . . +275°C Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.50 V ≤ VCC ≤ 5.50 V Operating case temperature (TC) . . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . XX percent 2/ Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices. | |
| language | English | |
| title | SMD-5962-91762 REV B | num |
| title | MICROCIRCUIT, DIGITAL, CMOS, 4 X 8 BIT MULTILEVEL PIPELINE REGISTER, MONOLITHIC SILICON | en |
| type | standard | |
| page | 19 | |
| status | Active | |
| tree | DLA - CC - DLA Land and Maritime:;1993 | |
| contenttype | fulltext |
