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JEDEC JESD22-B106D
Resistance to Solder Shock for Through-Hole Mounted Devices
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JEDEC - Solid State Technology Association
Year: 2008
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JEDEC JESD22-B106D
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T18:49:50Z | |
| date available | 2017-09-04T18:49:50Z | |
| date copyright | 04/01/2008 | |
| date issued | 2008 | |
| identifier other | ANQIFCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=3826AF679D40527318548F1Egin/handle/yse/231216 | |
| language | English | |
| title | JEDEC JESD22-B106D | num |
| title | Resistance to Solder Shock for Through-Hole Mounted Devices | en |
| type | standard | |
| page | 12 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2008 | |
| contenttype | fulltext |