SMD-5962-90705

Tue, 01 Jan 1991 00:00:00 GMT

SMD-5962-90705; MICROCIRCUITS, DIGITAL, HIGH SPEED CMOS, BCD DECADE COUNTER, ASYNCHRONOUS RESET, MONOLITHIC SILICON DLA - CC - DLA Land and Maritime This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:

       Device type          Generic number                        Circuit function             01                  54HCT160     BCD decade counter, asynchronous reset, TTL compatible inputs

The device class designator shall be a single letter identifying the product assurance level as follows:

       Device class                  Device requirements documentation              M                        Vendor self-certification to the requirements for non-JAN class B                                      microcircuits in accordance with 1.2.1 of MIL-STD-883            B or S                     Certification and qualification to MIL-M-38510            Q or V                     Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

       Outline letter                            Case outline                E       D-2 (16-lead, .840" × .310" × .200"), dual-in-line package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

  Supply voltage range (V_CC)  - - - - - - - - - - - - - - -    −0.5 V dc to +7.0 V dc   DC input voltage  - - - - - - - - - - - - - - - - - - - -    −0.5 V dc to V_CC + 0.5 V dc   DC output voltage - - - - - - - - - - - - - - - - - - - -    −0.5 V dc to V_CC + 0.5 V dc   Clamp diode current - - - - - - - - - - - - - - - - - - -    ±20 mA   DC output current (per pin) - - - - - - - - - - - - - - -    ±25 mA   DC V_CC or GND current (per pin) - - - - - - - - - - - - -    ±50 mA   Storage temperature range - - - - - - - - - - - - - - - -    −65°C to +150°C   Maximum power dissipation (P_D)  - - - - - - - - - - - - -    500 mW  2/   Lead temperature (soldering, 10 seconds)  - - - - - - - -    +300°C   Thermal resistance, junction-to-case (θ_JC)- - - - - - - -    See MIL-M-38510, appendix C   Junction temperature (T_J) - - - - - - - - - - - - - - - -    +175°C

  Supply voltage (V_CC)  - - - - - - - - - - - - - - - -    +4.5 V dc to +5.5 V dc   Input voltage (V_IN)   - - - - - - - - - - - - - - - -    0.0 V dc to V_CC   Output voltage (V_OUT) - - - - - - - - - - - - - - - -    0.0 V dc to V_CC   Case operating temperature (T_C) - - - - - - - - - - -    −55°C to +125°C   Input rise and fall time (t_r, t_f):     V_CC = 4.5 V, 5.5 V    - - - - - - - - - - - - - - -    0 to 500 ns   Minimum setup time, Pn to CP (t_s1):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    10 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    15 ns   Minimum setup time, PE to CP, TE to CP (t_s2):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    13 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    20 ns   Minimum setup time, [S bar][P bar][E bar] to CP (t_s3):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    12 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    18 ns   Minimum pulse width, CP (t_w1):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    16 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    24 ns   Minimum pulse width, [M bar][R bar] (t_w2):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    20 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    30 ns   Minimum hold time, Pn to CP (t_h1):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    5 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    5 ns   Minimum hold time, TE to CP, PE to CP(t_h2):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    3 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    3 ns   Minimum hold time, [S bar][P bar][E bar] to CP (t_h3):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    3 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    3 ns   Minimum recovery time, [M bar][R bar] to CP (t_REC):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    15 ns     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    22 ns   Maximum clock frequency, CP (f_MAX):     T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - -    30 MHz     T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - -    20 MHz

  Fault coverage measurement of manufacturing     logic tests (MIL-STD-883, test method 5012) - - - - -   XX percent  3/

Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices.

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