درباره ما
IPC J-STD-006B CHINESE
English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications;
Chinese -- 电子焊接领域 电子级焊料合金 及含有助焊剂 与不含助焊剂的 固体焊料的要求
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:38:10Z | |
| date available | 2017-09-04T16:38:10Z | |
| date copyright | 2013.07.01 | |
| date issued | 2013 | |
| identifier other | VHRRHFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/101753 | |
| language | Chinese | |
| title | IPC J-STD-006B CHINESE | num |
| title | English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications | en |
| title | Chinese -- 电子焊接领域 电子级焊料合金 及含有助焊剂 与不含助焊剂的 固体焊料的要求 | other |
| type | standard | |
| page | 36 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2013 | |
| contenttype | fulltext |
