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IPC 9708 CHINESE
Test Methods for Characterization of Printed Board Assembly Pad Cratering
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:41:18Z | |
| date available | 2017-09-04T16:41:18Z | |
| date copyright | 40513 | |
| date issued | 2010 | |
| identifier other | VOXLFFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/104638 | |
| language | English | |
| title | IPC 9708 CHINESE | num |
| title | Test Methods for Characterization of Printed Board Assembly Pad Cratering | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2010 | |
| contenttype | fulltext |
