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Printed Board Assembly Description in Digital Form

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:43:48Z
date available2017-09-04T16:43:48Z
date copyright01/01/1995
date issued1995
identifier otherVVIQCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/107129
description abstractThis standard is used to describe the relationship between components (electronic, electro-mechanical, and mechanical) and the printed boards used as the major form of interconnection. Included in these descriptions are the physical characteristics of components and boards required as input to an automated assembly system. The physical characteristics used in the electronic design process shall be described in digital form, in order to enable the data exchange and archiving capability between systems which support design, fabrication, assembly and testing. This structure provides the capability for describing all elements in their final form upon completion of manufacturing. It may be used for component preparation (sequencing, lead bonding, etc.), component insertion, adhesive application and component placement.
languageEnglish
titleIPC D-355num
titlePrinted Board Assembly Description in Digital Formen
typestandard
page40
statusActive
treeIPC - Association Connecting Electronics Industries:;1995
contenttypefulltext


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