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Information Requirements for Manufacturing Printed Boards and Other Electronic Assemblies

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:48:01Z
date available2017-09-04T16:48:01Z
date copyright01/01/2004
date issued2004
identifier otherWHAPEBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/111451
description abstractThis document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.
Purpose
The purpose of this document is to outline an effective method of transferring product assembly information intercompany or from OEM to the assembler.
Classification
The level of assembly documentation that is required is dependent on both the overall complexity of the product and whether the assembly process must meet government, military or other regulatory agency requirements.
languageEnglish
titleIPC D-326Anum
titleInformation Requirements for Manufacturing Printed Boards and Other Electronic Assembliesen
typestandard
page20
statusActive
treeIPC - Association Connecting Electronics Industries:;2004
contenttypefulltext


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