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IPC TM-650 2.3.24.1
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:48:41Z | |
| date available | 2017-09-04T16:48:41Z | |
| date copyright | 31321 | |
| date issued | 1985 | |
| identifier other | WIXICAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/112160 | |
| description abstract | This test method provides a procedure for testing the porosity of gold electroplated from an alkaline (cyanide), acid, or neutral gold plating solution on a nickel substrate in contact with the gold deposit. | |
| language | English | |
| title | IPC TM-650 2.3.24.1 | num |
| title | Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1985 | |
| contenttype | fulltext |
