IPC C-406

Abstract

With the present packaging trend in system design moving towards compact, low-power consumption configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. Sophisticated electronic assemblers, using a variety of interconnection and packaging techniques, employ the best of today's technology, intermixed with the appropriate state-of-the-art component and attachment processes. The degree of advancement in packaging of electronic components is predicated on the type of product being produced; the need for miniaturization and weight savings; plus the off-the-shelf availability of different component types. <br>The growing popularity of surface mount technology for packaging electronics has raised a need for surface mount connectors to provide a common packaging approach. <br>This document provides guidelines for the design, selection and application of soldered surface mount connectors for all types of printed boards, rigid, flexible-rigid and backplanes. (It does not cover solderless interconnections, such as those that employ conductive elastomers.) <br><strong>Purpose</strong> The purpose of this document is to provide information on design and application of connectors for surface mount application in order to aid the designer in effectively interconnecting this package. The connector material, design and mounting characteristics are discussed. Land patterns, solder joint configurations, assembly techniques, rework and repair procedures are also covered. <br>Adherence to the guidelines set forth in this document will generally assure adequate reliability for the majority of applications; however, more rigid requirements may be appropriate for more critical applications. <br>The methods listed herein shall not be construed as standards since the state-of-art is constantly changing and applications and requirements may vary beyond the scope of this publication.