IPC 9850A

Surface Mount Placement Equipment Characterization

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:58:09Z
date available	2017-09-04T16:58:09Z
date copyright	40848
date issued	2011
identifier other	XINPTEAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/121587
description abstract	This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine's placement capability and conformance to the specification while maintaining placement accuracy to placement throughput relationship. Purpose IPC-9850 has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment throughput and accuracy characterization parameters. These standardized tools shall be used to develop and report the information called out in this standard.
language	English
title	IPC 9850A	num
title	Surface Mount Placement Equipment Characterization	en
type	standard
page	60
status	Active
tree	IPC - Association Connecting Electronics Industries:;2011
contenttype	fulltext