درباره ما
IPC TM-650 2.4.1.3
Adhesion, Resistors (Hybrid Circuits)
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:59:41Z | |
| date available | 2017-09-04T16:59:41Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | XMLXCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/123108 | |
| description abstract | This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits. | |
| language | English | |
| title | IPC TM-650 2.4.1.3 | num |
| title | Adhesion, Resistors (Hybrid Circuits) | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |
