IPC 6012C

Qualification and Performance Specification for Rigid Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:00:58Z
date available	2017-09-04T17:00:58Z
date copyright	04/01/2010
date issued	2010
identifier other	XQCNQCAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/124475
description abstract	Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards based on the following constructions and/or technologies: • Single-sided, double-sided printed boards with or without plated-through holes (PTHs). • Multilayer printed boards with PTHs with or without buried/blind vias. • Multilayer printed boards containing build up High Density Interconnect (HDI) layers conforming to IPC-6016. • Active embedded passive circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components. • Metal core printed boards with or without an external metal heat frame, which may be active or nonactive.
language	English
title	IPC 6012C	num
title	Qualification and Performance Specification for Rigid Printed Boards	en
type	standard
page	60
status	Active
tree	IPC - Association Connecting Electronics Industries:;2010
contenttype	fulltext