IPC 6017

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:08:08Z
date available	2017-09-04T17:08:08Z
date copyright	03/01/2009
date issued	2009
identifier other	YJPOLCAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/131661
description abstract	Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).
language	English
title	IPC 6017	num
title	Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices	en
type	standard
page	20
status	Active
tree	IPC - Association Connecting Electronics Industries:;2009
contenttype	fulltext