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IPC IPC/JEDEC J-STD-033C-1

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:12:29Z
date available2017-09-04T17:12:29Z
date copyright2014.08.01
date issued2014
identifier otherCAMUJFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/135990
languageEnglish
titleIPC IPC/JEDEC J-STD-033C-1num
titleHandling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devicesen
typestandard
page28
statusActive
treeIPC - Association Connecting Electronics Industries:;2014
contenttypefulltext


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