IPC SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:17:34Z
date available	2017-09-04T17:17:34Z
date copyright	07/01/1988
date issued	1988
identifier other	ZIMSCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/140903
description abstract	This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates necessary for sophisticated electronic assemblies.
language	English
title	IPC SM-780	num
title	Component Packaging and Interconnecting with Emphasis on Surface Mounting	en
type	standard
page	168
status	Active
tree	IPC - Association Connecting Electronics Industries:;1988
contenttype	fulltext