IPC 6015

Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:18:27Z
date available	2017-09-04T17:18:27Z
date copyright	02/01/1998
date issued	1998
identifier other	ZKYHCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/141794
description abstract	This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module (MCM-L) assembly, and the quality and reliability assurance requirements that must be met for their acquisition.
language	English
title	IPC 6015	num
title	Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures	en
type	standard
page	32
status	Active
tree	IPC - Association Connecting Electronics Industries:;1998
contenttype	fulltext