درباره ما
IPC TM-650 2.5.32
Resistance Test, Plated Through Holes
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:34:41Z | |
| date available | 2017-09-04T17:34:41Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | DFYXCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/157572 | |
| description abstract | To determine the change in resistance of plated through-holes after being subjected to repeated thermal cycling conditions. | |
| language | English | |
| title | IPC TM-650 2.5.32 | num |
| title | Resistance Test, Plated Through Holes | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |
