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Torsional Strength of Chip Adhesives

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:41:21Z
date available2017-09-04T17:41:21Z
date copyright02/01/1988
date issued1988
identifier otherDXTWCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/164379
description abstractThis procedure establishes the performance and test guidelines for the break-off torque of adhesives used by placement equipment to attach surface mounted devices to printed wiring boards.
languageEnglish
titleIPC TM-650 2.4.42num
titleTorsional Strength of Chip Adhesivesen
typestandard
page1
statusActive
treeIPC - Association Connecting Electronics Industries:;1988
contenttypefulltext


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