IPC 6018B

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:47:51Z
date available	2017-09-04T17:47:51Z
date copyright	40848
date issued	2011
identifier other	EPUPREAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/171109
description abstract	This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers conforming to IPC-6016. Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (Microwave) printed boards.
language	English
title	IPC 6018B	num
title	Qualification and Performance Specification for High Frequency (Microwave) Printed Boards	en
type	standard
page	56
status	Active
tree	IPC - Association Connecting Electronics Industries:;2011
contenttype	fulltext