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IPC TM-650 2.3.4.2A
Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:11:58Z | |
| date available | 2017-09-04T18:11:58Z | |
| date copyright | 34669 | |
| date issued | 1994 | |
| identifier other | HBFICAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/194982 | |
| description abstract | This method is designed to evaluate the resistance of dielectric materials to organic chemicals representative of those used in printed board fabrication and assembly. It is intended to provide a distinction between materials of varying chemical resistance and, when applicable, an indication of the degree of cure. | |
| language | English | |
| title | IPC TM-650 2.3.4.2A | num |
| title | Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1994 | |
| contenttype | fulltext |
