IPC TM-650 2.4.24.4

Abstract

This test is designed to determine the glass transition temperature (Tg) and room temperature storage modulus (E') of dielectric materials used in High Density Interconnect (HDI) and Microvias by the use of dynamic mechanical analysis (DMA). When testing a stand alone HDI dielectric layer, DMA will provide modulus as a function of temperature and glass transition for this layer. When DMA is used on built-up constructions, the data will be a complex curve representing the composite moduli and glass transitions. <br>Two methods are presented: <br>Method A for thick specimens Method <br>B for thin specimens (recommended for HDIS and Microvia dielectric layers). <br>For anisotropic materials (reinforced dielectrics), the x and y directions will have different modulus vs. temperature behavior. Anisotropic materials shall be tested in both the x and y directions.