IPC 4556

Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:26:31Z
date available	2017-09-04T16:26:31Z
date copyright	01/01/2013
date issued	2013
identifier other	UAPSBFAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/89742
description abstract	Statement of Scope This specification sets the requirements for the use of Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) as a surface finish for printed boards. This specification sets requirements for ENEPIG deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
language	English
title	IPC 4556	num
title	Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards	en
type	standard
page	92
status	Active
tree	IPC - Association Connecting Electronics Industries:;2013
contenttype	fulltext