IPC TM-650 2.1.3A

Plated Through Hole Structure Evaluation

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:35:40Z
date available	2017-09-04T16:35:40Z
date copyright	08/01/1976
date issued	1976
identifier other	VATSCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho18267D83FCDCAC6/handle/yse/99180
description abstract	After selective chemical removal of the glassepoxy from around the through hole and its associated circuitry, an examination can be made with a microscope of the plated-through hole (PTH), pad, and conductor at any angle.
language	English
title	IPC TM-650 2.1.3A	num
title	Plated Through Hole Structure Evaluation	en
type	standard
page	1
status	Active
tree	IPC - Association Connecting Electronics Industries:;1976
contenttype	fulltext