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IPC TM-650 2.1.1.2A
Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:12:29Z | |
| date available | 2017-09-04T17:12:29Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | YVOHFBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1826AF/handle/yse/136005 | |
| description abstract | This procedure is an alternate method for preparing multiple metallographic specimen(s) using microsection equipment. The specimen(s) is(are) for evaluation for quality of the laminate system, plated-through holes (PTHs), the copper foils, platings, and/or coatings. The same basic procedure may be used for examination of other areas on the product. Note: This microsection technique is a process and not a test method. Note: SAFETY The use of the materials listed in Section 4 may be limited or forbidden in some environments. Please review the Material Safety Data Sheet (MSDS) for the materials being used. | |
| language | English | |
| title | IPC TM-650 2.1.1.2A | num |
| title | Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate) | en |
| type | standard | |
| page | 5 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |
