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Guidelines for Reporting and Using Electronic Package Thermal Information

contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T15:48:28Z
date available2017-09-04T15:48:28Z
date copyright05/01/2005
date issued2005
identifier otherQBGDKBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho1826AF679/handle/yse/51409
description abstractThis document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.
languageEnglish
titleJEDEC JESD51-12num
titleGuidelines for Reporting and Using Electronic Package Thermal Informationen
typestandard
page24
statusActive
treeJEDEC - Solid State Technology Association:;2005
contenttypefulltext
subject keywordsElectronic Package
subject keywordsReporting
subject keywordsThermal


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