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JEDEC JESD22-A119
Low Temperature Storage Life
| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:14:04Z | |
| date available | 2017-09-04T15:14:04Z | |
| date copyright | 11/01/2004 (R 2009) | |
| date issued | 2009 | |
| identifier other | MCDTPCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/12823 | |
| description abstract | The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices. Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). During the test reduced temperatures (test conditions) are used without electrical stress applied. This test may be destructive, depending on Time, Temperature and Packaging (if any). | |
| language | English | |
| title | JEDEC JESD22-A119 | num |
| title | Low Temperature Storage Life | en |
| type | standard | |
| page | 10 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2009 | |
| contenttype | fulltext | |
| subject keywords | Low Temperature | |
| subject keywords | Low Temperature Storage Life - Test Method | |
| subject keywords | Storage Life | |
| subject keywords | Test Method - Low Temperature Storage Life |
