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JEDEC JESD22-B102E
Solderability
| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:47:13Z | |
| date available | 2017-09-04T15:47:13Z | |
| date copyright | 39356 | |
| date issued | 2007 | |
| identifier other | PXPCBCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1826AF679D/handle/yse/50015 | |
| description abstract | This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment. | |
| language | English | |
| title | JEDEC JESD22-B102E | num |
| title | Solderability | en |
| type | standard | |
| page | 26 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2007 | |
| contenttype | fulltext | |
| subject keywords | Solderability Testing - Dip and Look | |
| subject keywords | Test Method - Solderability |
