JEDEC JESD51-4

Thermal Test Chip Guideline (Wire Bond Type Chip) - Errata - September 1997; Replaces JEP129: 1997

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T15:15:06Z
date available	2017-09-04T15:15:06Z
date copyright	02/01/1997
date issued	1997
identifier other	MFHHCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho4703177/handle/yse/14007
description abstract	This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip design but allows flexibility in the materials and layout requirements.
language	English
title	JEDEC JESD51-4	num
title	Thermal Test Chip Guideline (Wire Bond Type Chip) - Errata - September 1997; Replaces JEP129: 1997	en
type	standard
page	14
status	Active
tree	JEDEC - Solid State Technology Association:;1997
contenttype	fulltext
subject keywords	Chip - Thermal Test
subject keywords	Thermal Test Chip
subject keywords	Wire Bond Type Chip