JEDEC JESD51-7

High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T15:37:42Z
date available	2017-09-04T15:37:42Z
date copyright	02/01/1999
date issued	1999
identifier other	OVTXHAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho4703177/handle/yse/39614
description abstract	This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.
language	English
title	JEDEC JESD51-7	num
title	High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages	en
type	standard
page	13
status	Active
tree	JEDEC - Solid State Technology Association:;1999
contenttype	fulltext
subject keywords	Analysis - Heat Flow
subject keywords	Test Board - Leaded Surface Mount
subject keywords	Thermal Conductivity