JEDEC JESD22-B111

Board Level Drop Test Method of Components for Handheld Electronic Products

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T15:38:02Z
date available	2017-09-04T15:38:02Z
date copyright	07/01/2003
date issued	2003
identifier other	OWXPJBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho4703177/handle/yse/40053
description abstract	This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.
language	English
title	JEDEC JESD22-B111	num
title	Board Level Drop Test Method of Components for Handheld Electronic Products	en
type	standard
page	22
status	Active
tree	JEDEC - Solid State Technology Association:;2003
contenttype	fulltext
subject keywords	Drop Test
subject keywords	Handheld Products
subject keywords	Test Method - Board Level Drop Test