BSI BS QC 760200
English -- Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures;
German -- Halbleiterbauelemente - Integrierte Schaltungen. Rahmenspezifikation fuer integrierte Schicht- und Hybridschaltungen auf Grundlage des Befaehigungsanerkennungsverfahrens<br>French -- Dispositifs a semiconducteurs. Circuits integres. Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d'agrement de savoir-faire
contributor author | BSI - British Standards Institution | |
date accessioned | 2017-09-04T15:20:12Z | |
date available | 2017-09-04T15:20:12Z | |
date copyright | 1997.08.15 | |
date issued | 1997 | |
identifier other | MVQECAAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;query=autho47037D83081DAC4241668F1E350F130D0Facilities%20Engine/handle/yse/20085 | |
description abstract | To be read in conjunction with BS QC 760000:1990 | |
language | English | |
title | BSI BS QC 760200 | num |
title | English -- Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices - Integrated Circuits - Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures | en |
title | German -- Halbleiterbauelemente - Integrierte Schaltungen. Rahmenspezifikation fuer integrierte Schicht- und Hybridschaltungen auf Grundlage des Befaehigungsanerkennungsverfahrens French -- Dispositifs a semiconducteurs. Circuits integres. Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d'agrement de savoir-faire | other |
type | standard | |
page | 54 | |
status | Active | |
tree | BSI - British Standards Institution:;1997 | |
contenttype | fulltext | |
subject keywords | Acceptance inspection | |
subject keywords | Approval testing | |
subject keywords | Assessed quality | |
subject keywords | Capability approval | |
subject keywords | Circuits | |
subject keywords | Classification systems | |
subject keywords | Damp-heat tests | |
subject keywords | Data layout | |
subject keywords | Detail specification | |
subject keywords | Dimensions | |
subject keywords | Electrical testing | |
subject keywords | Electronic equipment and components | |
subject keywords | Environmental testing | |
subject keywords | Flow charts | |
subject keywords | Hybrid integrated circuits | |
subject keywords | Inspection | |
subject keywords | Integrated circuits | |
subject keywords | Integrated film circuits | |
subject keywords | Maintenance | |
subject keywords | Mass | |
subject keywords | Mechanical testing | |
subject keywords | Packaging | |
subject keywords | Qualification approval | |
subject keywords | Quality assurance systems | |
subject keywords | Quality control | |
subject keywords | Ratings | |
subject keywords | Sampling methods | |
subject keywords | Semiconductor devices | |
subject keywords | Solderability testing | |
subject keywords | Specification (approval) | |
subject keywords | Statistical quality control | |
subject keywords | Testing conditions |