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Resistance to Soldering Heat, Soldering Method

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T17:38:56Z
date available2017-09-04T17:38:56Z
date copyright33178
date issued1990
identifier otherDRIRCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho47037D83081DAC4261598F1EFDEC014A0Facilities%20Engineering%20Command%226EFDEC9FCD0Facilities%20Engineering%20Command%22/handle/yse/161916
description abstractPurpose
This test is performed for the purpose of determining whether switches can withstand the heating effects of soldering to their terminations using a soldering iron. Heat is conducted through the termination into the switch, or radiant heat from the iron in close proximity to the switch body, or both. The heat of soldering may affect the electrical characteristics of the switch and may cause damage to the materials from which it is made, e.g., loosening of terminations, softening or distortion of insulation materials, weakening of mechanical joints, etc.
languageEnglish
titleECA EIA-448-22num
titleResistance to Soldering Heat, Soldering Methoden
typestandard
page4
statusActive
treeECIA - Electronic Components Industry Association:;1990
contenttypefulltext


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