TIA TSB-144

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

contributor author	TIA - Telecommunications Industry Association
date accessioned	2017-09-04T17:45:20Z
date available	2017-09-04T17:45:20Z
date copyright	04/01/2003 (R 2012)
date issued	2012
identifier other	EISWTEAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=autho47037D83FCDC49A961598F1EFDEC9FCD/handle/yse/168478
description abstract	The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.
language	English
title	TIA TSB-144	num
title	Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges	en
type	standard
page	24
status	Active
tree	TIA - Telecommunications Industry Association:;2012
contenttype	fulltext