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IEC 63055:2023-10 (IEEE Std 2401-2019)

contributor authorIEEE - The Institute of Electrical and Electronics Engineers, Inc.
date accessioned2024-12-17T08:08:45Z
date available2024-12-17T08:08:45Z
date copyright19 October 2023
date issued2023
identifier other10287910.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho47037D83FCDCAC4261598F1EFDEC014A/handle/yse/336272
description abstractA method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information/data.
languageEnglish
publisherIEEE - The Institute of Electrical and Electronics Engineers, Inc.
titleIEEE/IEC International Standard--Format for LSI-Package-Board Interoperable designen
titleIEC 63055:2023-10 (IEEE Std 2401-2019)num
typestandard
page298
statusActive
treeIEEE - The Institute of Electrical and Electronics Engineers, Inc.:;2023
contenttypefulltext
subject keywordslarge-scale integration (LSI)
subject keywordsnetlists
subject keywordsdesign rules
subject keywordsdesign analysis
subject keywordspackages for LSI circuits
subject keywordsVerilog-HDL
subject keywordsproject management
subject keywordsprinted circuit board
subject keywordsgeometries
subject keywordscommon interoperable format
subject keywordscomponents
subject keywordsIEEE 2401™
identifier DOI10.1109/IEEESTD.2023.10287910


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