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ECA EIA-540FAAA
Detail Specification for Multi- Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment - Stabilized: April 2013
| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:43:27Z | |
| date available | 2017-09-04T16:43:27Z | |
| date copyright | 06/10/1992 (S 2013) | |
| date issued | 2013 | |
| identifier other | VUEQGBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho4703AF67081DAC4261598F1EFDEC014A0Facilities%20Engineeri/handle/yse/106687 | |
| description abstract | The Muiti-Package Moduie Sockets of assessed & quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1.) b) Working vottage not to exceed 250 votts (mis). c) Current not to exceed 1.0 ampere per pin. OBJECT The object of this Detail Specification is to provide all information required usìng Sectionai Specification EIA-54ûFûûû as a base, for the identification and quality assessment of Muiti- Package Module Sockets for the NECQ quality system. The information contained herein or by reference is complete and sufficient for inspection purposes. | |
| language | English | |
| title | ECA EIA-540FAAA | num |
| title | Detail Specification for Multi- Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment - Stabilized: April 2013 | en |
| type | standard | |
| page | 0 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2013 | |
| contenttype | fulltext |
