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ECA EIA-540B0AA-A
Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment - Revision of EIA-540B0AA
| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T18:05:01Z | |
| date available | 2017-09-04T18:05:01Z | |
| date copyright | 37165 | |
| date issued | 2001 | |
| identifier other | ACFATAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho4703AF67081DAC4261598F1EFDEC014A0Facilities%20Engineeri/handle/yse/187963 | |
| description abstract | This specification covers interconnect systems typically used for production ball grid array (BGA) devices with pin counts of 1089 and greater. Purpose The purpose of this detail specification is to provide all information required for the identification and assessment of the BGA socket described herein. The information, contained herein or by reference, is complete and sufficient for inspection purposes. | |
| language | English | |
| title | ECA EIA-540B0AA-A | num |
| title | Detail Specification for Production Ball Grid Array (BGA) High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment - Revision of EIA-540B0AA | en |
| type | standard | |
| page | 40 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2001 | |
| contenttype | fulltext |
