https://yse.yabesh.ir/std/handle/yse/158 2026-04-23T19:51:34Z 2026-04-23T19:51:34Z IPC - Association Connecting Electronics Industries https://yse.yabesh.ir/std/handle/yse/236831 2017-10-18T11:13:47Z 2016-01-01T00:00:00Z

IPC D-640; English -- Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies IPC - Association Connecting Electronics Industries Scope: This document provides design and critical process requirements and technical insight for cable and wire harness assemblies incorporating optical fiber, optical cable and hybrid wiring technology. Reference materials listed in this text are among those considered as required reading. The User is encouraged to obtain all relevant referenced materials, as this document cannot (nor can any single document) cover every material, process, environment, performance or safety aspect that affect a given design. Purpose This standard is intended to provide information on the general design requirements for optical fiber, optical cable, hybrid wiring harness assemblies and fiber optic communications systems (FOCS) to the extent that they can be applied to the broad spectrum of optical cable and wiring harness design. This document is intended for use by the design engineer, manufacturing engineer, quality engineer or other individual responsible for the tailoring of specific requirements of this document to the applicable performance class. It is not the intent of this document to exclude any alternate or contractor-proprietary documents or processes that meet or exceed the baseline requirements established by this document. Use of alternate or contractor-proprietary documents or processes shall [A1A2A3] require review and prior approval of the User. For purposes of this document: a) The Designer is the design agent for the User. b) The User is the individual, organization, company, contractually designated authority or agency responsible for the procurement or design of electrical/electronic/electromechanical (EEE) hardware, and having the authority to define the class of equipment and any variation or restrictions to the requirements of this document (i.e., the originator/custodian of the contract detailing these requirements). The User is considered the Design Authority. c) The Supplier is considered the individual, organization or company which provides the Manufacturer (assembler) with components (e.g., electrical, electronic, electromechanical, mechanical, printed boards, etc.) and/or materials (e.g., solder, flux, cleaning agents, etc.). d) The Manufacturer is considered the entity that provides a service or product to the User.

2016-01-01T00:00:00Z IPC - Association Connecting Electronics Industries https://yse.yabesh.ir/std/handle/yse/236573 2017-10-18T11:12:54Z 2016-01-01T00:00:00Z

IPC 1071B; English -- Intellectual Property Protection in Printed Board Manufacturing IPC - Association Connecting Electronics Industries Scope: Purpose The purpose of this standard is to assist printed board (PB) manufacturers in the development of requirements for the protection of intellectual property (IP) for their customers in commercial, industrial and military and other highreliability markets. This standard focuses on protection of the inherent IP designed into the PB such that IP flows from the customer to the PB manufacturer and that IP incorporated into the PB is protected. Patent and other such ‘‘forever protection’’ of the manufactured product is beyond the scope of this document. This standard is not intended to be a legal guide. Please consult an attorney for questions of a legal nature. Levels of IP Protection This standard recognizes that electrical and electronic products are subject to classifications by intended end-item use. Additionally, different manufacturers and/or customers may desire different levels of IP protection. Three levels of IP protection have been established to reflect the differences in IP protection. Definition of Requirements The words ‘‘shall’’ and ‘‘shall not’’ are used in the text of this document where there is a requirement for IP protection. Selection of IP Level The user is responsible for selecting the desired level of IP protection. The procurement documentation or data package shall state the IP level and any exceptions to specific parameters, where appropriate. Criteria defined in this document reflect three levels of protection, which are as follows in 1.3.1 through 1.3.3. Level 1 – Basic IP Protection This level of requirements provides good IP protection and is best suited for highvolume consumer goods. Items may be manufactured globally under Level 1 IP protection. Level 2 – High IP Protection This level of requirements provides a higher level of IP protection and is best suited for high-value goods. In most cases, items may be manufactured globally under Level 2 IP protection. Level 3 – Advanced Level for Military, Government and Commercial IP Protection This level of requirements provides the highest IP protection and is best suited for military and other high-security systems. a. Level 3 activities required to be conducted in the United States (U.S.) or in a State Department- and Department of Defense- (or other appropriate government agency) approved location shall be under the strict supervision of U.S. citizens or those possessing legal U.S. residency. b. For Level 3 activities conducted for a different national government, the user shall adhere to all citizenship and residency requirements, regulations and laws of that national government.

2016-01-01T00:00:00Z IPC - Association Connecting Electronics Industries https://yse.yabesh.ir/std/handle/yse/236314 2017-10-18T11:11:56Z 2016-01-01T00:00:00Z

IPC 9121; English -- Troubleshooting for Printed Board Fabrication Processes IPC - Association Connecting Electronics Industries Scope: GENERAL INTRODUCTION This handbook provides problems, causes and possible corrective actions related to PWB manufacturing processes. To keep this document current, readers are encouraged to submit process problems with photos as well as proposed causes and solutions to the IPC 7-24 Printed Board Process Effects Handbook Subcommittee. Submissions will be considered for document revisions.

2016-01-01T00:00:00Z IPC - Association Connecting Electronics Industries https://yse.yabesh.ir/std/handle/yse/236178 2017-10-18T11:11:19Z 2017-01-01T00:00:00Z

IPC A-610FC ADD; English -- Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies IPC - Association Connecting Electronics Industries There is no abstract information for this document.

2017-01-01T00:00:00Z