SMD-5962-92243

MICROCIRCUIT, DIGITAL, FAST CMOS OCTAL INVERTING BIDIRECTIONAL TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITED OUTPUT VOLTAGE SWING, MONOLITHIC SILICON

Year: 1993

Abstract: This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q. and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example: CHART
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows: 
       Device type      Generic number                              Circuit function           01, 02           54FCT640T        Octal inverting bidirectional transceiver with three-state outputs,                                            TTL compatible inputs and limited output voltage swing.           03, 04           54FCT640AT       Octal inverting bidirectional transceiver with three-state outputs,                                            TTL compatible inputs and limited output voltage swing.           05, 06           54FCT640CT       Octal inverting bidirectional transceiver with three-state outputs,                                            TTL compatible inputs and limited output voltage swing.


The device class designator shall be a single letter identifying the product assurance level as follows: 
       Device class         Device requirements documentation              M               Vendor self-certification to the requirements for non-JAN class B microcircuits in                             accordance with 1.2.1 of MIL-STD-883            B or S            Certification and qualification to MIL-M-38510            Q or V            Certification and qualification to MIL-I-38535


The case outline(s) shall be as designated in MIL-STD-1835, and as follows: 
        Outline letter       Descriptive designator        Terminals        Package style               R               GDIP1-T20 or CDIP2-T20           20            dual-in-line              S               GDFP2-F20 or CDFP3-F20           20            flat package              2               CQCC1-N20                        20            leadless-chip-carrier package


The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. 
  Supply voltage range (VCC)  - - - - - - - - - - - - - - - - -   −0.5 V dc to +7.0 V dc   DC input voltage range (VIN)  - - - - - - - - - - - - - - - -   −0.5 V dc to VCC + 0.5 V dc  4/   DC output voltage range (VOUT)  - - - - - - - - - - - - - - -   −0.5 V dc to VCC + 0.5 V dc  4/   DC input clamp current (IIK) (VIN = −0.5 V) - - - - - - - - -   −20 mA   DC output clamp current (IOK) (VOUT = −0.5 V and +7.0 V)  - -   ±20 mA   DC output source current (IOH) per output - - - - - - - - - -   −30 mA   DC output sink current ( IOL) per output  - - - - - - - - - -   +70 mA   DC VCC current (ICC)  - - - - - - - - - - - - - - - - - - - -   ±260 mA   DC ground current (IGND)  - - - - - - - - - - - - - - - - - -   +550 mA   Storage temperature range (TSIG)  - - - - - - - - - - - - - -   −65°C to +150°C   Case temperature under bias (TBIAS) - - - - - - - - - - - - -   −65°C to +135°C   Maximum power dissipation (PD)  - - - - - - - - - - - - - - -   500 mW   Lead temperature (soldering, 10 seconds)  - - - - - - - - - -   +300°C   Thermal resistance, junction-to-case (θJC)  - - - - - - - - -   See MIL-STD-1835   Junction temperature (TJ) - - - - - - - - - - - - - - - - - -   +175°C


  Supply voltage range (VCC)  - - - - - - - - - - - - - - - - -   +4.5 V dc to +5.5 V dc   Input voltage range (VIN) - - - - - - - - - - - - - - - - - -   +0.0 V dc to VCC   Output voltage range (VOUT) - - - - - - - - - - - - - - - - -   +0.0 V dc to VCC   Maximum low level input voltage (VIL) - - - - - - - - - - - -   0.8 V   Minimum high level input voltage (VIH)  - - - - - - - - - - -   2.0 V   Case operating temperature range (TC) - - - - - - - - - - - -   −55°C to +125°C   Maximum input rise and fall rate (tr, tf ):     (from VIN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) - - - - - - - -   5 ns/V   Maximum high level output current (IOH):     device types 01, 03, and 05 - - - - - - - - - - - - - - - -   −12 mA     device types 02, 04, and 06 - - - - - - - - - - - - - - - -   −6 mA   Maximum low level output current (IOL)  - - - - - - - - - - -   48 mA


  Fault coverage measurement of manufacturing     logic tests (MIL-STD-883, test method 5012) - - - - - - - -   XX percent 5/


Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device classes B and Q devices will replace device class M devices.
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